Failure analysis

Failure Analysis (FA) is Hypersemi's root-cause service for power-device customers: for samples failing in incoming inspection, production or the field, we combine electrical re-test, non-destructive inspection and physical analysis to turn \"it failed\" into \"why it failed, and what to do next\".

Analysis Flow

• Background & re-test — collect failure context and operating conditions, re-measure key parameters to confirm the failure mode.
• Non-destructive inspection — external examination, X-Ray and acoustic imaging locate suspicious regions.
• Physical analysis — decapsulation, cross-sectioning and microscopy trace the evidence down to chip and package level.
• Conclusion & actions — a root-cause verdict with concrete improvement recommendations, backed by imagery.

Deliverables

Every project ends with a failure analysis report: symptom, localization path, root cause and actionable next steps — usable directly for supplier corrective actions, design changes or incoming-lot decisions. Volume sampling and monthly failure reviews are available as a retainer.