Customize chip design
Custom development from spec definition and circuit/layout design through to tape-out and validation.
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Hypersemi custom chip development takes your requirement from definition to silicon: a one-stop flow covering specification, circuit design, layout, tape-out and validation, run by the same team that supports volume production.
How the Flow Runs
- Specification — turn system requirements into a signed-off device spec: target applications, ratings and test plan.
- Circuit & layout design — schematic design, simulation and layout with power-device-specific DRC/EMC review.
- Tape-out & wafer fabrication — MPW or full-mask options matched to volume and schedule.
- Validation — CP/FT characterization against the spec, with engineering samples for system verification.
Why a Custom Part
When a catalog device forces compromises — an unconventional voltage class, a special package, integration that shrinks your BOM — a custom part pays back in performance and BOM cost. Hypersemi's own product lines (TVS, bridge rectifiers, MOSFETs, IGBTs, SiC) provide proven platform processes to start from, so development risk and lead time stay controlled.
Deliverables
- Device specification and test plan (agreed before design starts)
- Engineering samples with characterization report
- Mass-production readiness: CP/FT programs, quality documents and supply commitment
Start a Project
Bring us the application, the target parameters and your volume expectation — the feasibility review and a phased quotation come back from engineers, not sales scripts. Submit via the Contact page.
