珠海超星半导体有限公司

In the critical back-end stages of semiconductor manufacturing, wafer thinning and dicing are decisive for the mechanical robustness, packaging yield, and ultimate performance of the final die. HyperSemi provides high-precision, highly reliable wafer thinning and dicing services, backed by advanced equipment, deep process expertise, and stringent quality control. We are your trusted partner in the journey from wafer to individual die.