珠海超星半导体有限公司

CP testing, or wafer probe testing, refers to the electrical functionality and performance parameter testing of chips using probe cards and test equipment before the wafer is diced into individual chips.

In the critical back-end stages of semiconductor manufacturing, wafer thinning and dicing are decisive for the mechanical robustness, packaging yield, and ultimate performance of the final die. HyperSemi provides high-precision, highly reliable wafer thinning and dicing services, backed by advanced equipment, deep process expertise, and stringent quality control. We are your trusted partner in the journey from wafer to individual die.

Chip Failure Analysis (FA) is a critical discipline for ensuring product reliability and improving yield. Faced with challenges like functional failure, short circuits, leakage, or batch failures, HyperSemi delivers comprehensive root-cause analysis solutions. Leveraging a systematic approach, state-of-the-art equipment, and a team of seasoned experts, we help clients pinpoint design flaws, process issues, and application faults, enabling rapid problem closure and product enhancement.

In an era defined by AI, autonomous driving, and the pervasive Internet of Things, off-the-shelf semiconductors often fall short of delivering the optimized performance, power efficiency, and system integration required for true product differentiation. General-purpose processors may contain unnecessary circuitry, leading to inefficiencies in size, power, and cost for your specific application.