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Full-Cycle Custom Chip Development
Your Advantage – Full-Cycle Custom Chip Development
The Strategic Imperative for Custom Silicon
In an era defined by AI, autonomous driving, and the pervasive Internet of Things, off-the-shelf semiconductors often fall short of delivering the optimized performance, power efficiency, and system integration required for true product differentiation. General-purpose processors may contain unnecessary circuitry, leading to inefficiencies in size, power, and cost for your specific application.
Choosing a custom solution is a strategic decision that empowers you to:
Achieve Peak System Performance: Hardware tailored to your unique algorithms and data paths.
Secure Your Supply Chain: Partner with a trusted design house to mitigate geopolitical and sourcing uncertainties.
Optimize Total Cost of Ownership: Eliminate silicon waste, reduce component count, and achieve superior economics at scale.
Our Service: From Specification to Silicon
HyperSemi delivers end-to-end custom IC development services, transforming your concept into reliable, production-ready silicon. We guide you through every critical phase:
1. Specification & Feasibility Study
The journey begins with a deep analysis of your target system. We collaborate to define clear performance targets, power budgets, physical constraints, and interface requirements. Our team conducts thorough feasibility studies and architecture reviews to identify the optimal design approach, balancing power, speed, area, and cost. We advise on the merits of Full-Custom design for maximum performance in analog, RF, or memory blocks, versus Semi-Custom design for rapid integration of complex digital logic.
2. Design Implementation & Signoff-Quality Verification
Our engineering team employs industry-leading EDA tools and a vast portfolio of proven IP to bring your design to life. We specialize in Ultra-Low-Power design techniques—including power gating, multi-voltage domains, subthreshold operation, and advanced duty cycling—for battery-powered and always-on applications like medical implants, wearable sensors, and passive RFID tags. Our rigorous verification flow, guided by a "shift-left" methodology, incorporates extensive corner case simulation, formal verification, and hardware emulation to de-risk the design and strive for first-pass silicon success.
3. Fabrication, Packaging & Production Test Support
We manage the tape-out process with foundry partners, overseeing mask generation and wafer fabrication. We assist in selecting the optimal package—from leadframe and laminate to Wafer-Level Chip Scale Packaging (WLCSP)—to meet your mechanical, thermal, and electrical needs. Finally, we develop comprehensive test programs for both wafer probing and final packaged devices, ensuring consistent quality and long-term reliability with field failure rates measured in parts per million (PPM).
Why Partner with HyperSemi?
Proven Design Expertise: Our team possesses deep technical accumulation and a track record of successfully delivering complex SoCs on advanced process nodes.
Full-Cycle Ownership: We provide more than just design services; we offer complete turnkey support from architecture to production handoff, serving as your true one-stop partner.
Commitment to Your Success: We are invested in your product's success. Through close collaboration and relentless focus on quality, we mitigate your development risks and accelerate your time-to-market.
Ideal For: AI algorithm companies, cloud & data center providers, industrial automation leaders, automotive Tier-1 suppliers, and innovative hardware startups.
