珠海超星半导体有限公司

In the critical back-end stages of semiconductor manufacturing, wafer thinning and dicing are decisive for the mechanical robustness, packaging yield, and ultimate performance of the final die. HyperSemi provides high-precision, highly reliable wafer thinning and dicing services, backed by advanced equipment, deep process expertise, and stringent quality control. We are your trusted partner in the journey from wafer to individual die.

Core Process Capabilities

1. Wafer Thinning Services
Driven by the demand for ultra-thin form factors in mobile and wearable devices, We handle 6-inch, 8-inch, and 12-inch wafers. Standard thinning ranges from 100μm to 500μm, with ultra-thinning capabilities (e.g., below 50μm) available for the most demanding advanced packaging applications. wafer thinning has become essential. We grind your wafers to the precise target thickness while maximizing mechanical integrity and electrical properties. Our key Technologies:

• Temporary Bonding/ Debonding: For ultra-thin wafers, we employ advanced temporary bonding and debonding systems using UV or thermal slide techniques. This provides robust support during thinning and backside metallization, ensuring high yield.

• Backside Metallization: We provide high-quality backside metallization (e.g., Au, Ag, Cu) for devices requiring a backside ground plane.

• Stress Management: Through optimized grinding parameters and finishing processes like CMP or dry polishing, we effectively minimize mechanical stress and micro-cracks on the thinned wafer surface, enhancing die strength and long-term reliability.

2. Wafer Dicing Services
Dicing is the critical step of separating a wafer into individual die. Dicing quality directly impacts die edge integrity, chipping, and subsequent pick-and-place yield. Our cutting Technologies:

• Blade Dicing: For most materials (e.g., Si, GaAs), we utilize high-precision diamond blades. By optimizing blade type, spindle speed, feed speed, and coolant parameters, we control chipping to minimal levels (typically <10μm).

• Laser Dicing & Stealth Dicing: For brittle materials (e.g., glass, sapphire, low-k wafers) or applications requiring ultra-narrow streets and minimal chipping, we offer advanced laser dicing solutions. This technology features a small heat-affected zone and cleaner sidewalls, ideal for high-end devices extremely sensitive to chipping and contamination.

• Mounting & Cleaning: We provide professional wafer mounting (dicing tape) and post-dicing cleaning services to ensure die cleanliness and stability before shipping and pickup.

Why Choose Hypersemi?

• Ultra-Thin Processing & Low-Damage Dicing: Possess mature full-process capability for ultra-thin wafers (<100μm), combined with optimized dicing processes for near "zero-damage" die separation.

• Full In-House Process Control: Maintain complete in-house control from incoming inspection, process parameter setup, to final inspection, ensuring process consistency and full traceability.

• Customized Service Solutions: We understand the uniqueness of each chip design. Our engineering team works closely with you to tailor the optimal thinning and dicing process flow based on your chip material, structure, target thickness, and end application.

• Rapid Response & Expert Support: We offer flexible service cycles and transparent progress communication. Our team of process engineers is ready to provide technical consultation and problem-solving support.

Quality Commitment

All our processing is conducted in a high-class cleanroom environment. We employ in-line metrology for real-time monitoring of critical parameters (thickness, TTV, surface defects, chipping) and implement rigorous Statistical Process Control (SPC) to ensure stable, high-quality results for every wafer entrusted to us.

Target Applications: Mobile communication ICs, power devices, MEMS sensors, RF components, CIS image sensors, memory chips, and various advanced packaging (Flip-Chip, Fan-Out, 3D IC) products.

Contact our process service team today for detailed technical specifications and a quote. Let our precision processes protect and enhance the value of your chips. To learn more or discuss collaboration, please contact us via: info@hypersemi.com.cn