珠海超星半导体有限公司

In the semiconductor supply chain, wafer probe testing is the most critical quality control and cost management checkpoint before chip packaging. It provides direct yield data back to earlier manufacturing processes and effectively identifies defective chips, thus preventing unnecessary packaging costs. With advanced testing platforms, extensive engineering experience, and an efficient service system, HyperSemi offers customers high-coverage, high-reliability, and cost-effective wafer CP testing services, safeguarding the value of every wafer produced.

Our Core Testing Service Capabilities

We have built a flexible, scalable testing service platform to meet the diverse needs from R&D validation to large-scale production.

1. Comprehensive Testing Coverage

• DC Parameter Testing: Accurately measures basic electrical parameters such as open/short circuits, leakage current, supply current, transistor threshold voltage, and resistance/capacitance values.

• AC Parameter and Functional Testing: Executes logical function verification, operational speed testing, and analog/mixed-signal characteristic testing (e.g., ADC/DAC accuracy, PLL jitter).

• Specialized Testing: Conducts S-parameter, gain, and noise figure testing for RF chips; breakdown voltage and on-resistance testing for power devices; and memory unit read/write and redundancy repair testing.

2. Advanced Testing Hardware and Engineering Support

• Testing Platforms: Equipped with industry-leading automated test equipment, programmable power supplies, and high-precision measurement units to support testing requirements from low-power MCUs to high-performance SoCs, RF, and power devices.

• Probe Card Solutions: We collaborate closely with leading probe card suppliers to match you with the optimal cantilever, vertical, or MEMS probe card solution, providing expert needle mark analysis and maintenance recommendations.

• Test Program Development and Adaptation: Our experienced testing engineer team assists you throughout the entire process from test plan formulation and program development to mass production release, and quickly adapts to changes during engineering and production batches.

3. Data Management and Intelligent Analysis

•  provide robust backend data support: delivering not only standard testing result files and yield summaries
  

• Wafer Maps and Parameter Distribution Graphs: Visually highlighting the locations of defective chips and parameter distribution trends to assist in pinpointing process issues.

• Multidimensional Data Correlation Analysis: Correlating CP test data with subsequent FT and application-level test data to deeply explore root causes of failures.

• Real-Time Yield Monitoring and Alerts: Establishing SPC control charts to monitor critical testing parameters in real-time, with timely alerts for any anomalies.

Clear and Transparent standardized Service Process

• Requirements Assessment and Planning: Jointly review chip design specifications, testing requirements, and objectives, providing initial test plans and quotes.

• Hardware Preparation and Program Development: Coordinate hardware resources, such as probe cards, while concurrently developing and validating test programs.

• Engineering Batch Verification and Debugging: Conduct testing validation on the first wafer, optimizing testing conditions and programs until satisfactory coverage and yield are achieved.

• Mass Production Testing Execution and Data Delivery: Execute large-volume testing as scheduled, providing daily/weekly reports on progress and yield, and ultimately delivering all test data and wafers.

• Ongoing Support and Optimization: Provide continuous monitoring and technical support throughout the mass production process, optimizing test programs as needed.

Why is CP Testing Essential?

CP testing, or wafer probe testing, refers to the electrical functionality and performance parameter testing of chips using probe cards and test equipment before the wafer is diced into individual chips. Its core values include:

• Quality Monitoring and Process Feedback: Provides real-time wafer-level and chip-level yield distribution maps to quickly identify manufacturing process defects.

• Cost Savings: Eliminates functionally defective or substandard chips early, saving up to 80% on subsequent packaging and functional testing costs.

• Data-Driven Decision Making: Offers comprehensive testing data logs that serve as crucial references for product improvement, reliability analysis, and supply chain management.

Why Choose Hypersemi?

• Breadth and Depth of Technology: Our team possesses multi-product line and multi-process node testing experience, allowing us to quickly understand your technical challenges and provide solutions.

• Asset and Cost Advantages: We have invested in comprehensive testing assets, freeing you from high equipment depreciation and maintenance costs, enabling a lean operating model.

• Flexible and Efficient Delivery: Delivering full-cycle services from engineering validation and small-batch production to large-scale manufacturing, with a rapid response and reliable delivery timelines.

• Commitment to Data Security: We prioritize customer intellectual property and data security, establishing stringent confidentiality agreements and a robust data management system.

Whether you are a startup chip design company or an industry leader needing capacity expansion, HyperSemi is your reliable partner for CP testing. Let our expertise in testing capabilities accelerate the high-quality and efficient launch of your products.  To learn more or discuss collaboration, please contact us via: info@hypersemi.com.cn